Wafer Thinning and Dicing Film - Global and China Top Players Market Share and Ranking 2023
- Report Code : AMP2759063
- Published On: Oct, 2024
- Category : Chemicals & Materials
- Pages : 152
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According to latest Research, the global market for Wafer Thinning and Dicing Film should grow from US$ million in 2023 to US$ million by 2030, with a CAGR of % for the period of 2024-2030.
By country, China accounted for percent of the global market last year and China’s market share increased from percent to percent. China Wafer Thinning and Dicing Film market should grow from US$ million in 2023 to US$ million by 2030, with a CAGR of % for the period of 2024-2030. The United States Wafer Thinning and Dicing Film market should grow from US$ million in 2023 to US$ million by 2030, with a CAGR of % for the period of 2024-2030.
By segment, Back Grinding grew percent to account for percent of the total market sales, and Wafer Dicing grew percent.
Tapes are mainly used in two major processes of wafer back grinding and wafer dicing in semiconductor applications. Both grinding tape and dicing tape include Non-UV Tape and UV Tape. Non-UV type refers to the general traditional pressure-sensitive adhesive tape. Considering the ease of peeling, its adhesive force is generally lower than that of UV type (before UV exposure), which is about 100~400 gf/25mm. UV tape is a pressure-sensitive tape with high adhesive strength before exposure, and its peel force will be greatly reduced after exposure to UV light. Wafer back grinding tape (BG Tape) mainly refers to the protection and fixation of the front circuit of the wafer when the back grinding is thinned after the wafer is manufactured, and prevents damage to the front circuit of the wafer during the back grinding of the wafer. The dicing tape (Dicing Tape) is mainly used for fixing, dicing, expansion, UV debonding, separation, etc. in the semiconductor wafer and packaging process.
This report studies and analyses global Wafer Thinning and Dicing Film status and future trends, helps the client to determine the Wafer Thinning and Dicing Film market size of the total market opportunity by Type, by Application, by company, and by region & country. This report is a detailed and comprehensive analysis of the world market for Wafer Thinning and Dicing Film, and provides market size (in Tons & US$ million) and Year-over-Year growth, considering 2023 as the base year.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
To assess the competitive environment within the market including supplier revenue, market share, and company profiles.
Highlights
(1) Global Wafer Thinning and Dicing Film market size, history data 2019-2024, and forecast data 2024 -2029, (US$ million) & (Tons)
(2) Global Wafer Thinning and Dicing Film sales, revenue, price by company, market share and industry ranking 2019-2024, (US$ million) & (Tons)
(3) China Wafer Thinning and Dicing Film sales, revenue, price by company, market share and industry ranking 2019-2024, (US$ million) & (Tons)
(4) Global Wafer Thinning and Dicing Film key consuming regions, consumption quantity, consumption value and demand structure
(5) Global Wafer Thinning and Dicing Film key producing regions, capacity, production, and year over year growth
(6) Wafer Thinning and Dicing Film industry chains, upstream, midstream and downstream
Market segment by players, this report covers
Mitsui Chemicals Tohcello
LINTEC
Denka
Nitto
Furukawa Electric
Sumitomo Bakelite
D&X
AI Technology
ULTRON SYSTEM
maxell
NDS
KGK Chemical
NEXTECK
WISE new material
Vistaic
Suzhou BoYan Jingjin Photoelectric
Market segment by Type, covers
UV Film
Non-UV Film
Market segment by Application, can be divided into
Back Grinding
Wafer Dicing
Market segment by regions, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, UK, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, South Korea, India, Southeast Asia, Australia, and Rest of Asia-Pacific)
South America (Brazil, Rest of South America)
Middle East & Africa
Report Includes:
Chapter 1: to describe Wafer Thinning and Dicing Film product scope, global sales quantity, value and average price, China sales quantity, value and average price, development opportunities, challenges, trends, and policies.
Chapter 2: Global Wafer Thinning and Dicing Film market share and ranking of major manufacturers, sales quantity, revenue, average price, 2019-2024
Chapter 3: China Wafer Thinning and Dicing Film market share and ranking of major manufacturers, sales quantity, revenue, average price, 2019-2024
Chapter 4: Global key producing regions of Wafer Thinning and Dicing Film, percent & CAGR, 2018-2029
Chapter 5: Wafer Thinning and Dicing Film industry chain, upstream, medium-stream, and downstream.
Chapter 6: Segment by Type, sales quantity, average price, consumption value, percent & CAGR, 2018-2029
Chapter 7: Segment by Application, sales quantity, average price, consumption value, percent & CAGR, 2018-2029
Chapter 8: Segment in regional level, sales quantity, average price, consumption value, percent & CAGR, 2018-2029
Chapter 9: Segment in country level, sales quantity, average price, consumption value, percent & CAGR, 2018-2029
Chapter 10: Company profile, introducing the basic situation of the main companies in the market in detail, including product specifications, application, recent development, sales quantity, average price, revenue, gross margin.
Chapter 11: Conclusions
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With tables and figures helping analyze worldwide Wafer Thinning and Dicing Film Global and China Top Players market, this research provides key statistics on the state of the industry and is a valuable source of guidance and direction for companies and individuals interested in the market.
1 Market Overview1.1 Wafer Thinning and Dicing Film Definition
1.2 Global Wafer Thinning and Dicing Film Market Size and Forecast
1.2.1 By Consumption Value, Global Wafer Thinning and Dicing Film Market Size，2019-2030
1.2.2 By Sales Quantity, Global Wafer Thinning and Dicing Film Market Size，2019-2030
1.2.3 Global Wafer Thinning and Dicing Film Average Selling Price (ASP)，2019-20301.3 China Wafer Thinning and Dicing Film Market Size and Forecast
1.3.1 By Consumption Value, China Wafer Thinning and Dicing Film Market Size，2019-2030
1.3.2 By Sales Quantity, China Wafer Thinning and Dicing Film Market Size，2019-2030
1.3.3 China Wafer Thinning and Dicing Film Average Selling Price (ASP)， 2019-20301.4 Share of China Wafer Thinning and Dicing Film Market with Respect to the Global Market
1.4.1 By Consumption Value, China Wafer Thinning and Dicing Film Market Share in Global, 2019-2030
1.4.2 By Sales Quantity, China Wafer Thinning and Dicing Film Market Share in Global, 2019-2030
1.4.3 Wafer Thinning and Dicing Film Market Size: China VS Global, 2019-20301.5 Wafer Thinning and Dicing Film Market Dynamics
1.5.1 Wafer Thinning and Dicing Film Market Drivers
1.5.2 Wafer Thinning and Dicing Film Market Restraints
1.5.3 Wafer Thinning and Dicing Film Industry Trends
1.5.4 Wafer Thinning and Dicing Film Industry Policy
2 Global Leading Manufacturers and Market Share2.1 By Revenue of Wafer Thinning and Dicing Film, Global Market Share by Company, 2019-2024
2.2 By Sales Quantity of Wafer Thinning and Dicing Film, Global Market Share by Company, 2019-2024
2.3 Wafer Thinning and Dicing Film Average Selling Price (ASP) by Company, 2019-2024
2.4 Global Wafer Thinning and Dicing Film Participants, Market Position (Tier 1, Tier 2, and Tier 3)
2.5 Global Wafer Thinning and Dicing Film Concentration Ratio
2.6 Global Wafer Thinning and Dicing Film Mergers & Acquisitions, Expansion Plans
2.7 Global Wafer Thinning and Dicing Film Manufacturers Product Type
2.8 Head Office and Wafer Thinning and Dicing Film Production Site of Key Manufacturer
2.9 Wafer Thinning and Dicing Film Capacity of Major Manufacturers and Future Plan
3 China Leading Manufacturers and Market Share3.1 By Revenue of Wafer Thinning and Dicing Film, China Market Share by Company, 2019-2024
3.2 By Sales Quantity of Wafer Thinning and Dicing Film, China Market Share by Company, 2019-2024
3.3 China Wafer Thinning and Dicing Film Participants, Market Position (Tier 1, Tier 2, and Tier 3)
4 Global Producing Regions4.1 Global Wafer Thinning and Dicing Film Capacity, Output and Capacity Utilization, 2019-2030
4.2 Global Wafer Thinning and Dicing Film Capacity by Region
4.3 Global Wafer Thinning and Dicing Film Production & Forecast by Region, 2019 VS 2024 VS 2030
4.4 Global Wafer Thinning and Dicing Film Production by Region, 2019-2030
4.5 Global Wafer Thinning and Dicing Film Production Market Share & Forecast by Region, 2019-2030
5 Industry Chain Analysis5.1 Wafer Thinning and Dicing Film Industry Chain
5.2 Wafer Thinning and Dicing Film Upstream Analysis
5.2.1 Wafer Thinning and Dicing Film Core Raw Materials
5.2.2 Main Manufacturers of Wafer Thinning and Dicing Film Core Raw Materials5.3 Midstream Analysis
5.4 Downstream Analysis
5.5 Wafer Thinning and Dicing Film Production Mode
5.6 Wafer Thinning and Dicing Film Procurement Model
5.7 Wafer Thinning and Dicing Film Industry Sales Model and Sales Channels
5.7.1 Wafer Thinning and Dicing Film Sales Model
5.7.2 Wafer Thinning and Dicing Film Typical Distributors
6 Sights by Type6.1 Wafer Thinning and Dicing Film Classification
6.1.1 UV Film
6.1.2 Non-UV Film6.2 By Type, Global Wafer Thinning and Dicing Film Consumption Value & CAGR, 2019 VS 2024 VS 2030
6.3 By Type, Global Wafer Thinning and Dicing Film Consumption Value, 2019-2030
6.4 By Type, Global Wafer Thinning and Dicing Film Sales Quantity, 2019-2030
6.5 By Type, Global Wafer Thinning and Dicing Film Average Selling Price (ASP), 2019-2030
7 Sights by Application7.1 Wafer Thinning and Dicing Film Segment by Application
7.1.1 Back Grinding
7.1.2 Wafer Dicing7.2 By Application, Global Wafer Thinning and Dicing Film Consumption Value & CAGR, 2019 VS 2024 VS 2030
7.3 By Application, Global Wafer Thinning and Dicing Film Consumption Value, 2019-2030
7.4 By Application, Global Wafer Thinning and Dicing Film Sales Quantity, 2019-2030
7.5 By Application, Global Wafer Thinning and Dicing Film Price, 2019-2030
8 Sales Sights by Region8.1 By Region, Global Wafer Thinning and Dicing Film Consumption Value, 2019 VS 2024 VS 2030
8.2 By Region, Global Wafer Thinning and Dicing Film Consumption Value, 2019-2030
8.3 By Region, Global Wafer Thinning and Dicing Film Sales Quantity, 2019-2030
8.4 North America
8.4.1 North America Wafer Thinning and Dicing Film & Forecasts, 2019-2030
8.4.2 By Country, North America Wafer Thinning and Dicing Film Market Size Market Share8.5 Europe
8.5.1 Europe Wafer Thinning and Dicing Film Market Size & Forecasts, 2019-2030
8.5.2 By Country, Europe Wafer Thinning and Dicing Film Market Size Market Share8.6 Asia Pacific
8.6.1 Asia Pacific Wafer Thinning and Dicing Film Market Size & Forecasts, 2019-2030
8.6.2 By Country/Region, Asia Pacific Wafer Thinning and Dicing Film Market Size Market Share
8.7 South America
8.7.1 South America Wafer Thinning and Dicing Film Market Size & Forecasts, 2019-2030
8.7.2 By Country, South America Wafer Thinning and Dicing Film Market Size Market Share
8.8 Middle East & Africa
9 Sales Sights by Country Level9.1 By Country, Global Wafer Thinning and Dicing Film Market Size & CAGR, 2019 VS 2024 VS 2030
9.2 By Country, Global Wafer Thinning and Dicing Film Consumption Value, 2019-2030
9.3 By Country, Global Wafer Thinning and Dicing Film Sales Quantity, 2019-2030
9.4 U.S.
9.4.1 U.S. Wafer Thinning and Dicing Film Market Size, 2019-2030
9.4.2 By Type, U.S. Wafer Thinning and Dicing Film Sales Quantity Market Share, 2024 VS 2030
9.4.3 By Application, U.S. Wafer Thinning and Dicing Film Sales Quantity Market Share, 2024 VS 20309.5 Europe
9.5.1 Europe Wafer Thinning and Dicing Film Market Size, 2019-2030
9.5.2 By Type, Europe Wafer Thinning and Dicing Film Sales Quantity Market Share, 2024 VS 2030
9.5.3 By Application, Europe Wafer Thinning and Dicing Film Sales Quantity Market Share, 2024 VS 20309.6 China
9.6.1 China Wafer Thinning and Dicing Film Market Size, 2019-2030
9.6.2 By Type, China Wafer Thinning and Dicing Film Sales Quantity Market Share, 2024 VS 2030
9.6.3 By Application, China Wafer Thinning and Dicing Film Sales Quantity Market Share, 2024 VS 2030
9.7 Japan
9.7.1 Japan Wafer Thinning and Dicing Film Market Size, 2019-2030
9.7.2 By Type, Japan Wafer Thinning and Dicing Film Sales Quantity Market Share, 2024 VS 2030
9.7.3 By Application, Japan Wafer Thinning and Dicing Film Sales Quantity Market Share, 2024 VS 2030
9.8 South Korea
9.8.1 South Korea Wafer Thinning and Dicing Film Market Size, 2019-2030
9.8.2 By Type, South Korea Wafer Thinning and Dicing Film Sales Quantity Market Share, 2024 VS 2030
9.8.3 By Application, South Korea Wafer Thinning and Dicing Film Sales Quantity Market Share, 2024 VS 2030
9.9 Southeast Asia
9.9.1 Southeast Asia Wafer Thinning and Dicing Film Market Size, 2019-2030
9.9.2 By Type, Southeast Asia Wafer Thinning and Dicing Film Sales Quantity Market Share, 2024 VS 2030
9.9.3 By Application, Southeast Asia Wafer Thinning and Dicing Film Sales Quantity Market Share, 2024 VS 20309.10 India
9.10.1 India Wafer Thinning and Dicing Film Market Size, 2019-2030
9.10.2 By Type, India Wafer Thinning and Dicing Film Sales Quantity Market Share, 2024 VS 2030
9.10.3 By Application, India Wafer Thinning and Dicing Film Sales Quantity Market Share, 2024 VS 2030
9.11 Middle East & Africa
9.11.1 Middle East & Africa Wafer Thinning and Dicing Film Market Size, 2019-2030
9.11.2 By Type, Middle East & Africa Wafer Thinning and Dicing Film Sales Quantity Market Share, 2024 VS 2030
9.11.3 By Application, Middle East & Africa Wafer Thinning and Dicing Film Sales Quantity Market Share, 2024 VS 2030
10 Manufacturers Profile10.1 Mitsui Chemicals Tohcello
10.1.1 Mitsui Chemicals Tohcello Company Information, Head Office, Market Area, and Industry Position
10.1.2 Mitsui Chemicals Tohcello Wafer Thinning and Dicing Film Models, Specifications, and Application
10.1.3 Mitsui Chemicals Tohcello Wafer Thinning and Dicing Film Sales Quantity, Revenue, Price and Gross Margin, 2019-2024
10.1.4 Mitsui Chemicals Tohcello Company Profile and Main Business
10.1.5 Mitsui Chemicals Tohcello Recent Developments10.2 LINTEC
10.2.1 LINTEC Company Information, Head Office, Market Area, and Industry Position
10.2.2 LINTEC Wafer Thinning and Dicing Film Models, Specifications, and Application
10.2.3 LINTEC Wafer Thinning and Dicing Film Sales Quantity, Revenue, Price and Gross Margin, 2019-2024
10.2.4 LINTEC Company Profile and Main Business
10.2.5 LINTEC Recent Developments10.3 Denka
10.3.1 Denka Company Information, Head Office, Market Area, and Industry Position
10.3.2 Denka Wafer Thinning and Dicing Film Models, Specifications, and Application
10.3.3 Denka Wafer Thinning and Dicing Film Sales Quantity, Revenue, Price and Gross Margin, 2019-2024
10.3.4 Denka Company Profile and Main Business
10.3.5 Denka Recent Developments10.4 Nitto
10.4.1 Nitto Company Information, Head Office, Market Area, and Industry Position
10.4.2 Nitto Wafer Thinning and Dicing Film Models, Specifications, and Application
10.4.3 Nitto Wafer Thinning and Dicing Film Sales Quantity, Revenue, Price and Gross Margin, 2019-2024
10.4.4 Nitto Company Profile and Main Business
10.4.5 Nitto Recent Developments10.5 Furukawa Electric
10.5.1 Furukawa Electric Company Information, Head Office, Market Area, and Industry Position
10.5.2 Furukawa Electric Wafer Thinning and Dicing Film Models, Specifications, and Application
10.5.3 Furukawa Electric Wafer Thinning and Dicing Film Sales Quantity, Revenue, Price and Gross Margin, 2019-2024
10.5.4 Furukawa Electric Company Profile and Main Business
10.5.5 Furukawa Electric Recent Developments10.6 Sumitomo Bakelite
10.6.1 Sumitomo Bakelite Company Information, Head Office, Market Area, and Industry Position
10.6.2 Sumitomo Bakelite Wafer Thinning and Dicing Film Models, Specifications, and Application
10.6.3 Sumitomo Bakelite Wafer Thinning and Dicing Film Sales Quantity, Revenue, Price and Gross Margin, 2019-2024
10.6.4 Sumitomo Bakelite Company Profile and Main Business
10.6.5 Sumitomo Bakelite Recent Developments
10.7 D&X
10.7.1 D&X Company Information, Head Office, Market Area, and Industry Position
10.7.2 D&X Wafer Thinning and Dicing Film Models, Specifications, and Application
10.7.3 D&X Wafer Thinning and Dicing Film Sales Quantity, Revenue, Price and Gross Margin, 2019-2024
10.7.4 D&X Company Profile and Main Business
10.7.5 D&X Recent Developments
10.8 AI Technology
10.8.1 AI Technology Company Information, Head Office, Market Area, and Industry Position
10.8.2 AI Technology Wafer Thinning and Dicing Film Models, Specifications, and Application
10.8.3 AI Technology Wafer Thinning and Dicing Film Sales Quantity, Revenue, Price and Gross Margin, 2019-2024
10.8.4 AI Technology Company Profile and Main Business
10.8.5 AI Technology Recent Developments
10.9 ULTRON SYSTEM
10.9.1 ULTRON SYSTEM Company Information, Head Office, Market Area, and Industry Position
10.9.2 ULTRON SYSTEM Wafer Thinning and Dicing Film Models, Specifications, and Application
10.9.3 ULTRON SYSTEM Wafer Thinning and Dicing Film Sales Quantity, Revenue, Price and Gross Margin, 2019-2024
10.9.4 ULTRON SYSTEM Company Profile and Main Business
10.9.5 ULTRON SYSTEM Recent Developments10.10 maxell
10.10.1 maxell Company Information, Head Office, Market Area, and Industry Position
10.10.2 maxell Wafer Thinning and Dicing Film Models, Specifications, and Application
10.10.3 maxell Wafer Thinning and Dicing Film Sales Quantity, Revenue, Price and Gross Margin, 2019-2024
10.10.4 maxell Company Profile and Main Business
10.10.5 maxell Recent Developments
10.11 NDS
10.11.1 NDS Company Information, Head Office, Market Area, and Industry Position
10.11.2 NDS Wafer Thinning and Dicing Film Models, Specifications, and Application
10.11.3 NDS Wafer Thinning and Dicing Film Sales Quantity, Revenue, Price and Gross Margin, 2019-2024
10.11.4 NDS Company Profile and Main Business
10.11.5 NDS Recent Developments
10.12 KGK Chemical
10.12.1 KGK Chemical Company Information, Head Office, Market Area, and Industry Position
10.12.2 KGK Chemical Wafer Thinning and Dicing Film Models, Specifications, and Application
10.12.3 KGK Chemical Wafer Thinning and Dicing Film Sales Quantity, Revenue, Price and Gross Margin, 2019-2024
10.12.4 KGK Chemical Company Profile and Main Business
10.12.5 KGK Chemical Recent Developments
10.13 NEXTECK
10.13.1 NEXTECK Company Information, Head Office, Market Area, and Industry Position
10.13.2 NEXTECK Wafer Thinning and Dicing Film Models, Specifications, and Application
10.13.3 NEXTECK Wafer Thinning and Dicing Film Sales Quantity, Revenue, Price and Gross Margin, 2019-2024
10.13.4 NEXTECK Company Profile and Main Business
10.13.5 NEXTECK Recent Developments
10.14 WISE new material
10.14.1 WISE new material Company Information, Head Office, Market Area, and Industry Position
10.14.2 WISE new material Wafer Thinning and Dicing Film Models, Specifications, and Application
10.14.3 WISE new material Wafer Thinning and Dicing Film Sales Quantity, Revenue, Price and Gross Margin, 2019-2024
10.14.4 WISE new material Company Profile and Main Business
10.14.5 WISE new material Recent Developments
10.15 Vistaic
10.15.1 Vistaic Company Information, Head Office, Market Area, and Industry Position
10.15.2 Vistaic Wafer Thinning and Dicing Film Models, Specifications, and Application
10.15.3 Vistaic Wafer Thinning and Dicing Film Sales Quantity, Revenue, Price and Gross Margin, 2019-2024
10.15.4 Vistaic Company Profile and Main Business
10.15.5 Vistaic Recent Developments
10.16 Suzhou BoYan Jingjin Photoelectric
10.16.1 Suzhou BoYan Jingjin Photoelectric Company Information, Head Office, Market Area, and Industry Position
10.16.2 Suzhou BoYan Jingjin Photoelectric Wafer Thinning and Dicing Film Models, Specifications, and Application
10.16.3 Suzhou BoYan Jingjin Photoelectric Wafer Thinning and Dicing Film Sales Quantity, Revenue, Price and Gross Margin, 2019-2024
10.16.4 Suzhou BoYan Jingjin Photoelectric Company Profile and Main Business
10.16.5 Suzhou BoYan Jingjin Photoelectric Recent Developments
11 Conclusion
12 Appendix12.1 Research Methodology
12.2 Data Source
12.2.1 Secondary Sources
12.2.2 Primary Sources12.3 Market Estimation Model
12.4 Disclaimer
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The Wafer Thinning and Dicing Film Global and China Top Players Market has been segregated into various crucial divisions including applications, types, and regions. Each market segment is intensively studied in the report contemplating its market acceptance, worthiness, demand, and growth prospects. The segmentation analysis will help the client to customize their marketing approach to have a better command of each segment and to identify the most prospective customer base.
Report Objectives / Segmentation Covered :
By Companies / players:
By Regions:
By Type:
By Application:
Frequently asked questions(FAQ's):
Recognize the areas along the Wafer Thinning and Dicing Film Global and China Top Players Market's value chain where players are generating value. To get a complete picture, kindly read the entire report.
In 2023, the Wafer Thinning and Dicing Film Global and China Top Players Market share surpassed USD xx million, and between 2024 and 2029, it will grow at a CAGR of yy%.
A handful of disruptive trends, nevertheless, will have a contradictory and significant impact on the development of the Wafer Thinning and Dicing Film Global and China Top Players Market as well as its distribution among its players
The Wafer Thinning and Dicing Film Global and China Top Players study focuses on shifting market dynamics, geopolitical and regulatory regulations, and key players' strategies to carefully analyze demand at risk across multiple industry categories.
