Global and China Hermetic Packaging Industry Ecological Development and Analysis Report 2023

The research time span covered by the report is from 2018 to 2029; it provides an overview of the Global Hermetic Packaging Market and also provides a deeper in-depth segmentation of the market by regions, product type and downstream industries.

The hermetic packaging market was valued at USD 3.70 billion in 2022 and is expected to reach USD 6.32 billion by 2030, registering a CAGR of 6.90% during the forecast period of 2023 to 2030.

MARKET COMPETITIVE LANDSCAPE:

The main players in the Hermetic Packaging market include Teledyne Technologies (U.S.), SCHOTT (Germany), Amkor Technology (U.S.), KYOCERA Corporation (Japan), and Materion Corporation (U.S.). The share of the top 3 players in the Hermetic Packaging market is xx%.

REGION SHARE:

The report covers the market size information of North America, Europe, Asia Pacific, Latin America, Middle East and Africa, and North America accounted for xx%, Europe accounted for xx% of Hermetic Packaging market, and Asia Pacific accounted for xx%.

SEGMENT OVERVIEW:

The report segments the market by Type and Application. Multilayer Ceramic Packages accounted for xx% of Hermetic Packaging market in 2022. Metal Can Packages and Pressed Ceramic Packages share of xx%.

Sensors accounted for xx% of the Hermetic Packaging market in 2022. Photodiodes accounts for xx%.

For competitive landscape, prominent players with considerable market shares are comprehensively analyzed in this report. With information regarding the concentration ratio and detailed data reflecting the market performance of each player shared, the readers can acquire a holistic view of the competitive situation and a better understanding of their competitors.

As the COVID-19 takes over the world, we are continuously tracking the changes in the markets. We analyzed the impact of the pandemic in detail, along with other key factors, such as macro-economy, regional conflicts, industry related news and policies. Meanwhile, market investment scenario, technology status and developments, supply chain challenges, among other essential research elements are all covered.

Key Factors Considered:

COVID-19

The report describes the market scenario during and post the pandemic in the vision of upstream, major market participants, downstream major customers, etc. Other aspects, such as changes in consumer behavior, demand, transport capacity, trade flow under COVID-19, have also been taken into consideration during the process of the research.

Regional Conflict / Russia-Ukraine War

The report also presents the impact of regional conflict on this market in an effort to aid the readers to understand how the market has been adversely influenced and how it's going to evolve in the years to come.

Challenges & Opportunities

Factors that may help create opportunities and boost profits for market players, as well as challenges that may restrain or even pose a threat to the development of the players, are revealed in the report, which can shed a light on strategic decisions and implementation.

The storage market is cold, and advanced technologies continue to develop.

With the rising inflation and weak demand in the terminal market, especially the decline in demand for PC and mobile phone terminal products affected by consumer spending, the growth expectation of the consumer storage market is lowered. In addition, the reduction of investment in data centers by technology giants such as Microsoft and Amazon will put downward pressure on the commercial storage market.

Although the consumer storage market will be cold, the market demand for applications such as automobiles is strong. With the substantial increase in sales of new energy vehicles, the amount of storage products required for bicycles will be greatly improved, especially after introducing other intelligent technologies such as ADAS and autonomous driving.

Different from the "uneven heat and cold" in various storage markets, major storage manufacturers have been trying and breaking through in the technical process. For example, in the field of DRAM, Micron's fifth-generation 10nm DRAM product (1β DRAM) has been sent to its partners for verification. Once the product is mature, it will be put into mobile phones, computers, servers, automobiles and other markets one after another.

In the field of NAND Flash, Micron's first 232-layer NAND product in the world has been mass-produced and is being supplied to PC OEM customers around the world; SK Hynix 238-layer 512Gb TLC 4D NAND flash memory is expected to be put into mass production in the first half of 2023. Samsung's plan is even bolder, claiming that it will realize 1,000 layers of V-NAND by 2030.

Highlights-Regions

North America

United States

Canada

China

Asia Pacific (Excluding China)

Japan

Korea

Southeast Asia

India

Australia

EMEA

Europe

Germany

France

UK

Italy

Russia

Nordic

Middle East

Africa

Latin America

Brazil

Argentina

Mexico

Player list

Teledyne Technologies (U.S.)

SCHOTT (Germany)

Amkor Technology (U.S.)

KYOCERA Corporation (Japan)

Materion Corporation (U.S.)

Egide (France)

SGA Technologies (U.K.)

Complete Hermetics (U.S.)

Special Hermetic Products Inc. (U.S.)

Coat-X SA (Switzerland)

Hermetics Solutions Group (U.S.)

StratEdge (U.S.)

Mackin Technologies (U.S.)

Palomar Technologies (U.S.)

CeramTec Gmbh (Germany)

Electronic Products Inc. (U.S.)

NGK Insulators Ltd. (Japan)

Remtec Inc. (Canada)

Types list

Multilayer Ceramic Packages

Metal Can Packages and Pressed Ceramic Packages

Application list

Sensors

Photodiodes

Transistors

Lasers

Airbag Ignitors

MEMS Switches

Oscillating Crystals