2.5D and 3D IC Packaging - Global and China Top Players Market Share and Ranking 2024
- Report Code : AMP2756277
- Published On: Jul, 2024
- Category : Semiconductor & Electronics
- Pages : 156
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According to Ample Market Research, the global market for 2.5D and 3D IC Packaging should grow from US$ million in 2023 to US$ million by 2030, with a CAGR of % for the period of 2024-2030.
By country, China accounted for percent of the global market last year and China’s market share increased from percent to percent. China 2.5D and 3D IC Packaging market should grow from US$ million in 2023 to US$ million by 2030, with a CAGR of % for the period of 2024-2030. The United States 2.5D and 3D IC Packaging market should grow from US$ million in 2023 to US$ million by 2030, with a CAGR of % for the period of 2024-2030.
By segment, Consumer Electronics grew percent to account for percent of the total market sales, and Medical Devices grew percent.
In 2.5D structure, two or more active semiconductor chips are placed side-by-side on a silicon interposer for achieving extremely high die-to-die interconnect density. In 3D structure, active chips are integrated by die stacking for shortest interconnect and smallest package footprint.
This report studies and analyses global 2.5D and 3D IC Packaging status and future trends, to help determine the 2.5D and 3D IC Packaging market size of the total market opportunity by Type, by Application, by company, and by region & country. This report is a detailed and comprehensive analysis of the world market for 2.5D and 3D IC Packaging, and provides market size (US$ million) and Year-over-Year growth, considering 2024 as the base year.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
To assess the competitive environment within the market including supplier revenue, market share, and company profiles.
Highlights
(1) Global 2.5D and 3D IC Packaging market size, history data 2019-2024, and forecast data 2024-2030, (US$ million)
(2) Global 2.5D and 3D IC Packaging by company, revenue, market share and industry ranking 2019-2024, (US$ million)
(3) China 2.5D and 3D IC Packaging by company, revenue, market share and industry ranking 2019-2024, (US$ million)
(4) Global 2.5D and 3D IC Packaging key consuming regions, consumption value and demand structure
(5) 2.5D and 3D IC Packaging industry chains, upstream, midstream and downstream
Market segment by players, this report covers
ASE Technology
Samsung Electronics
Toshiba
STMicroelectronics
Xilinx
Intel
Micron Technology
TSMC
SK Hynix
Amkor Technology
GlobalFoundries
SanDisk (Western Digital)
Synopsys
Invensas
Siliconware Precision Industries
Jiangsu Changjiang Electronics
Powertech Technology
Market segment by Type, covers
2.5D
3D TSV
3D Wafer-level Chip-scale Packaging
Market segment by Application, can be divided into
Consumer Electronics
Medical Devices
Communications and Telecom
Automotive
Other
Market segment by regions, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, UK, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, South Korea, India, Southeast Asia, Australia, and Rest of Asia-Pacific)
South America (Brazil, Rest of South America)
Middle East & Africa
Report Includes:
Chapter 1: to describe 2.5D and 3D IC Packaging product scope, global consumption value, China consumption value, development opportunities, challenges, trends, and policies.
Chapter 2: Global 2.5D and 3D IC Packaging market share and ranking of major manufacturers, revenue, 2019-2024
Chapter 3: China 2.5D and 3D IC Packaging market share and ranking of major manufacturers, revenue, 2019-2024
Chapter 4: 2.5D and 3D IC Packaging industry chain, upstream, medium-stream, and downstream.
Chapter 5: Segment by Type, consumption value, percent & CAGR, 2019-2030
Chapter 6: Segment by Application, consumption value, percent & CAGR, 2019-2030
Chapter 7: Segment in regional level, consumption value, percent & CAGR, 2019-2030
Chapter 8: Segment in country level, consumption value, percent & CAGR, 2019-2030
Chapter 9: Company profile, introducing the basic situation of the main companies in the market in detail, including product specifications, application, recent development, revenue, gross margin.
Chapter 10: Conclusions
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With tables and figures helping analyze worldwide 2.5D and 3D IC Packaging Global and China Top Players market, this research provides key statistics on the state of the industry and is a valuable source of guidance and direction for companies and individuals interested in the market.
1 Market Overview
1.1 2.5D and 3D IC Packaging Definition1.2 Global 2.5D and 3D IC Packaging Market Size and Forecast
1.3 China 2.5D and 3D IC Packaging Market Size and Forecast
1.4 China Percentage in Global Market
1.5 2.5D and 3D IC Packaging Market Size: China VS Global Growth Rate, 2019-2030
1.6 2.5D and 3D IC Packaging Market Dynamics
1.6.1 2.5D and 3D IC Packaging Market Drivers
1.6.2 2.5D and 3D IC Packaging Market Restraints
1.6.3 2.5D and 3D IC Packaging Industry Trends
1.6.4 2.5D and 3D IC Packaging Industry Policy
2 Global Leading Players and Market Share2.1 By Revenue of 2.5D and 3D IC Packaging, Global Market Share by Company, 2019-2024
2.2 Global 2.5D and 3D IC Packaging Participants, Market Position (Tier 1, Tier 2, and Tier 3)
2.3 Global 2.5D and 3D IC Packaging Concentration Ratio
2.4 Global 2.5D and 3D IC Packaging Mergers & Acquisitions, Expansion Plans
2.5 Global 2.5D and 3D IC Packaging Major Companies Product Type
2.6 Head Office and 2.5D and 3D IC Packaging Production Site of Key Manufacturer
3 China Leading Players, Market Share and Ranking3.1 By Revenue of 2.5D and 3D IC Packaging, China Market Share by Company, 2019-2024
3.2 China 2.5D and 3D IC Packaging Participants, Market Position (Tier 1, Tier 2, and Tier 3)
4 Industry Chain Analysis
4.1 2.5D and 3D IC Packaging Industry Chain
4.2 2.5D and 3D IC Packaging Upstream Analysis
4.2.1 2.5D and 3D IC Packaging Core Raw Materials
4.2.2 Main Manufacturers of 2.5D and 3D IC Packaging Core Raw Materials4.3 Midstream Analysis
4.4 Downstream Analysis
4.5 2.5D and 3D IC Packaging Production Mode
4.6 2.5D and 3D IC Packaging Procurement Model
4.7 2.5D and 3D IC Packaging Industry Sales Model and Sales Channels
4.7.1 2.5D and 3D IC Packaging Sales Model
4.7.2 2.5D and 3D IC Packaging Typical Distributors
5 Sights by Type
5.1 2.5D and 3D IC Packaging Classification
5.1.1 2.5D
5.1.2 3D TSV
5.1.3 3D Wafer-level Chip-scale Packaging5.2 By Type, Global 2.5D and 3D IC Packaging Consumption Value & CAGR, 2019 VS 2024 VS 2030
5.3 By Type, Global 2.5D and 3D IC Packaging Consumption Value, 2019-2030
6 Sights by Application
6.1 2.5D and 3D IC Packaging Segment by Application
6.1.1 Consumer Electronics
6.1.2 Medical Devices
6.1.3 Communications and Telecom
6.1.4 Automotive
6.1.5 Other6.2 By Application, Global 2.5D and 3D IC Packaging Consumption Value & CAGR, 2019 VS 2024 VS 2030
6.3 By Application, Global 2.5D and 3D IC Packaging Consumption Value, 2019-2030
7 Sales Sights by Region7.1 By Region, Global 2.5D and 3D IC Packaging Consumption Value, 2019 VS 2024 VS 2030
7.2 By Region, Global 2.5D and 3D IC Packaging Consumption Value, 2019-2030
7.3 North America
7.3.1 North America 2.5D and 3D IC Packaging & Forecasts, 2019-2030
7.3.2 By Country, North America 2.5D and 3D IC Packaging Market Size Market Share7.4 Europe
7.4.1 Europe 2.5D and 3D IC Packaging Market Size & Forecasts, 2019-2030
7.4.2 By Country, Europe 2.5D and 3D IC Packaging Market Size Market Share7.5 Asia Pacific
7.5.1 Asia Pacific 2.5D and 3D IC Packaging Market Size & Forecasts, 2019-2030
7.5.2 By Country/Region, Asia Pacific 2.5D and 3D IC Packaging Market Size Market Share7.6 South America
7.6.1 South America 2.5D and 3D IC Packaging Market Size & Forecasts, 2019-2030
7.6.2 By Country, South America 2.5D and 3D IC Packaging Market Size Market Share
7.7 Middle East & Africa
8 Sales Sights by Country Level8.1 By Country, Global 2.5D and 3D IC Packaging Market Size & CAGR, 2019 VS 2024 VS 2030
8.2 By Country, Global 2.5D and 3D IC Packaging Consumption Value, 2019-2030
8.3 U.S.
8.3.1 U.S. 2.5D and 3D IC Packaging Market Size, 2019-2030
8.3.2 By Type, U.S. 2.5D and 3D IC Packaging Consumption Value Market Share, 2024 VS 2030
8.3.3 By Application, U.S. 2.5D and 3D IC Packaging Consumption Value Market Share, 2024 VS 20308.4 Europe
8.4.1 Europe 2.5D and 3D IC Packaging Market Size, 2019-2030
8.4.2 By Type, Europe 2.5D and 3D IC Packaging Consumption Value Market Share, 2024 VS 2030
8.4.3 By Application, Europe 2.5D and 3D IC Packaging Consumption Value Market Share, 2024 VS 20308.5 China
8.5.1 China 2.5D and 3D IC Packaging Market Size, 2019-2030
8.5.2 By Type, China 2.5D and 3D IC Packaging Consumption Value Market Share, 2024 VS 2030
8.5.3 By Application, China 2.5D and 3D IC Packaging Consumption Value Market Share, 2024 VS 20308.6 Japan
8.6.1 Japan 2.5D and 3D IC Packaging Market Size, 2019-2030
8.6.2 By Type, Japan 2.5D and 3D IC Packaging Consumption Value Market Share, 2024 VS 2030
8.6.3 By Application, Japan 2.5D and 3D IC Packaging Consumption Value Market Share, 2024 VS 2030
8.7 South Korea
8.7.1 South Korea 2.5D and 3D IC Packaging Market Size, 2019-2030
8.7.2 By Type, South Korea 2.5D and 3D IC Packaging Consumption Value Market Share, 2024 VS 2030
8.7.3 By Application, South Korea 2.5D and 3D IC Packaging Consumption Value Market Share, 2024 VS 2030
8.8 Southeast Asia
8.8.1 Southeast Asia 2.5D and 3D IC Packaging Market Size, 2019-2030
8.8.2 By Type, Southeast Asia 2.5D and 3D IC Packaging Consumption Value Market Share, 2024 VS 2030
8.8.3 By Application, Southeast Asia 2.5D and 3D IC Packaging Consumption Value Market Share, 2024 VS 2030
8.9 India
8.9.1 India 2.5D and 3D IC Packaging Market Size, 2019-2030
8.9.2 By Type, India 2.5D and 3D IC Packaging Consumption Value Market Share, 2024 VS 2030
8.9.3 By Application, India 2.5D and 3D IC Packaging Consumption Value Market Share, 2024 VS 20308.10 Middle East & Africa
8.10.1 Middle East & Africa 2.5D and 3D IC Packaging Market Size, 2019-2030
8.10.2 By Type, Middle East & Africa 2.5D and 3D IC Packaging Consumption Value Market Share, 2024 VS 2030
8.10.3 By Application, Middle East & Africa 2.5D and 3D IC Packaging Consumption Value Market Share, 2024 VS 2030
9 Company Profile9.1 ASE Technology
9.1.1 ASE Technology Company Information, Head Office, Market Area and Industry Position
9.1.2 ASE Technology Company Profile and Main Business
9.1.3 ASE Technology 2.5D and 3D IC Packaging Models, Specifications and Application
9.1.4 ASE Technology 2.5D and 3D IC Packaging Revenue and Gross Margin, 2019-2024
9.1.5 ASE Technology Recent Developments9.2 Samsung Electronics
9.2.1 Samsung Electronics Company Information, Head Office, Market Area and Industry Position
9.2.2 Samsung Electronics Company Profile and Main Business
9.2.3 Samsung Electronics 2.5D and 3D IC Packaging Models, Specifications and Application
9.2.4 Samsung Electronics 2.5D and 3D IC Packaging Revenue and Gross Margin, 2019-2024
9.2.5 Samsung Electronics Recent Developments9.3 Toshiba
9.3.1 Toshiba Company Information, Head Office, Market Area and Industry Position
9.3.2 Toshiba Company Profile and Main Business
9.3.3 Toshiba 2.5D and 3D IC Packaging Models, Specifications and Application
9.3.4 Toshiba 2.5D and 3D IC Packaging Revenue and Gross Margin, 2019-2024
9.3.5 Toshiba Recent Developments9.4 STMicroelectronics
9.4.1 STMicroelectronics Company Information, Head Office, Market Area and Industry Position
9.4.2 STMicroelectronics Company Profile and Main Business
9.4.3 STMicroelectronics 2.5D and 3D IC Packaging Models, Specifications and Application
9.4.4 STMicroelectronics 2.5D and 3D IC Packaging Revenue and Gross Margin, 2019-2024
9.4.5 STMicroelectronics Recent Developments9.5 Xilinx
9.5.1 Xilinx Company Information, Head Office, Market Area and Industry Position
9.5.2 Xilinx Company Profile and Main Business
9.5.3 Xilinx 2.5D and 3D IC Packaging Models, Specifications and Application
9.5.4 Xilinx 2.5D and 3D IC Packaging Revenue and Gross Margin, 2019-2024
9.5.5 Xilinx Recent Developments9.6 Intel
9.6.1 Intel Company Information, Head Office, Market Area and Industry Position
9.6.2 Intel Company Profile and Main Business
9.6.3 Intel 2.5D and 3D IC Packaging Models, Specifications and Application
9.6.4 Intel 2.5D and 3D IC Packaging Revenue and Gross Margin, 2019-2024
9.6.5 Intel Recent Developments
9.7 Micron Technology
9.7.1 Micron Technology Company Information, Head Office, Market Area and Industry Position
9.7.2 Micron Technology Company Profile and Main Business
9.7.3 Micron Technology 2.5D and 3D IC Packaging Models, Specifications and Application
9.7.4 Micron Technology 2.5D and 3D IC Packaging Revenue and Gross Margin, 2019-2024
9.7.5 Micron Technology Recent Developments
9.8 TSMC
9.8.1 TSMC Company Information, Head Office, Market Area and Industry Position
9.8.2 TSMC Company Profile and Main Business
9.8.3 TSMC 2.5D and 3D IC Packaging Models, Specifications and Application
9.8.4 TSMC 2.5D and 3D IC Packaging Revenue and Gross Margin, 2019-2024
9.8.5 TSMC Recent Developments
9.9 SK Hynix
9.9.1 SK Hynix Company Information, Head Office, Market Area and Industry Position
9.9.2 SK Hynix Company Profile and Main Business
9.9.3 SK Hynix 2.5D and 3D IC Packaging Models, Specifications and Application
9.9.4 SK Hynix 2.5D and 3D IC Packaging Revenue and Gross Margin, 2019-2024
9.9.5 SK Hynix Recent Developments9.10 Amkor Technology
9.10.1 Amkor Technology Company Information, Head Office, Market Area and Industry Position
9.10.2 Amkor Technology Company Profile and Main Business
9.10.3 Amkor Technology 2.5D and 3D IC Packaging Models, Specifications and Application
9.10.4 Amkor Technology 2.5D and 3D IC Packaging Revenue and Gross Margin, 2019-2024
9.10.5 Amkor Technology Recent Developments
9.11 GlobalFoundries
9.11.1 GlobalFoundries Company Information, Head Office, Market Area and Industry Position
9.11.2 GlobalFoundries Company Profile and Main Business
9.11.3 GlobalFoundries 2.5D and 3D IC Packaging Models, Specifications and Application
9.11.4 GlobalFoundries 2.5D and 3D IC Packaging Revenue and Gross Margin, 2019-2024
9.11.5 GlobalFoundries Recent Developments
9.12 SanDisk (Western Digital)
9.12.1 SanDisk (Western Digital) Company Information, Head Office, Market Area and Industry Position
9.12.2 SanDisk (Western Digital) Company Profile and Main Business
9.12.3 SanDisk (Western Digital) 2.5D and 3D IC Packaging Models, Specifications and Application
9.12.4 SanDisk (Western Digital) 2.5D and 3D IC Packaging Revenue and Gross Margin, 2019-2024
9.12.5 SanDisk (Western Digital) Recent Developments
9.13 Synopsys
9.13.1 Synopsys Company Information, Head Office, Market Area and Industry Position
9.13.2 Synopsys Company Profile and Main Business
9.13.3 Synopsys 2.5D and 3D IC Packaging Models, Specifications and Application
9.13.4 Synopsys 2.5D and 3D IC Packaging Revenue and Gross Margin, 2019-2024
9.13.5 Synopsys Recent Developments
9.14 Invensas
9.14.1 Invensas Company Information, Head Office, Market Area and Industry Position
9.14.2 Invensas Company Profile and Main Business
9.14.3 Invensas 2.5D and 3D IC Packaging Models, Specifications and Application
9.14.4 Invensas 2.5D and 3D IC Packaging Revenue and Gross Margin, 2019-2024
9.14.5 Invensas Recent Developments
9.15 Siliconware Precision Industries
9.15.1 Siliconware Precision Industries Company Information, Head Office, Market Area and Industry Position
9.15.2 Siliconware Precision Industries Company Profile and Main Business
9.15.3 Siliconware Precision Industries 2.5D and 3D IC Packaging Models, Specifications and Application
9.15.4 Siliconware Precision Industries 2.5D and 3D IC Packaging Revenue and Gross Margin, 2019-2024
9.15.5 Siliconware Precision Industries Recent Developments
9.16 Jiangsu Changjiang Electronics
9.16.1 Jiangsu Changjiang Electronics Company Information, Head Office, Market Area and Industry Position
9.16.2 Jiangsu Changjiang Electronics Company Profile and Main Business
9.16.3 Jiangsu Changjiang Electronics 2.5D and 3D IC Packaging Models, Specifications and Application
9.16.4 Jiangsu Changjiang Electronics 2.5D and 3D IC Packaging Revenue and Gross Margin, 2019-2024
9.16.5 Jiangsu Changjiang Electronics Recent Developments
9.17 Powertech Technology
9.17.1 Powertech Technology Company Information, Head Office, Market Area and Industry Position
9.17.2 Powertech Technology Company Profile and Main Business
9.17.3 Powertech Technology 2.5D and 3D IC Packaging Models, Specifications and Application
9.17.4 Powertech Technology 2.5D and 3D IC Packaging Revenue and Gross Margin, 2019-2024
9.17.5 Powertech Technology Recent Developments
10 Conclusion
11 Appendix11.1 Research Methodology
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources11.3 Market Estimation Model
11.4 Disclaimer
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The 2.5D and 3D IC Packaging Global and China Top Players Market has been segregated into various crucial divisions including applications, types, and regions. Each market segment is intensively studied in the report contemplating its market acceptance, worthiness, demand, and growth prospects. The segmentation analysis will help the client to customize their marketing approach to have a better command of each segment and to identify the most prospective customer base.
Report Objectives / Segmentation Covered :
By Companies / players:
By Regions:
By Type:
By Application:
Frequently asked questions(FAQ's):
Recognize the areas along the 2.5D and 3D IC Packaging Global and China Top Players Market's value chain where players are generating value. To get a complete picture, kindly read the entire report.
The 2.5D and 3D IC Packaging Global and China Top Players Market study evaluates the year spans as follows: Historical year: 2018 to 2023; Base year: 2023; Forecast period**: 2024 to 2029 [** unless otherwise stated]
Yes, the add-on segmentation is available in the premium customised version of the 2.5D and 3D IC Packaging Global and China Top Players Market report for a more in-depth analysis. It aids in the calculation of refined and precise market values.
The 2.5D and 3D IC Packaging Global and China Top Players Market is expected to reach a considerable market valuation.
